IJPAM: Volume 115, No. 2 (2017)

Title

STEADY-STATE HEAT CONDUCTION PROBLEM IN
A THICK CIRCULAR PLATE AND ITS THERMAL STRESSES

Authors

Kishor R. Gaikwad
PG Department of Mathematics
NES, Science College
Nanded, Maharashtra, 431605, INDIA

Abstract

The present paper deals with the determination of a quasi-static thermal stresses in a thick circular plate subjected to arbitrary temperature on the outer circular edge, with lower and upper face are at zero temperature. The governing heat conduction equation has been solved by using finite Fourier sine transform technique. The results are obtained in series form in terms of Bessel’s functions. The results for displacement and stresses have been computed numerically and illustrated graphically.

History

Received: January 10, 2017
Revised: April 27, 2017
Published: July 14, 2017

AMS Classification, Key Words

AMS Subject Classification: 35B07, 35G30, 35K05, 44A10
Key Words and Phrases: quasi-static, thermal stresses, heat conduction problem, thick circular plate, steady-state

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Bibliography

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How to Cite?

DOI: 10.12732/ijpam.v115i2.8 How to cite this paper?

Source: International Journal of Pure and Applied Mathematics
ISSN printed version: 1311-8080
ISSN on-line version: 1314-3395
Year: 2017
Volume: 115
Issue: 2
Pages: 301 - 310


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